Description: Technical Product BulletinTHERMALLY CONDUCTIVE ELECTRICALLY INSULATING COMPOUND PRODUCT DESCRIPTION:AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed circuit boards.AA-BOND 2153 is two parts adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation.AA-BOND 2153 bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials.AA-BOND 2153 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals. GENERAL PROPERTIES:AppearanceDark greyCure TypeHeat cure or room temperatureBenefitsStrongDurableHigh impact bonds at room temperature Mix Ratio by weight100:7 / Resin: HardenerOutgassing, NASAPassesTypical ApplicationStaking transistors,DiodesResistorsIntegrated circuitsOther heat-sensitive components to printed circuit boards UNCURED PROPERTIES:Specific Gravity, mixed2.44Reactive solids contents, %100Pot Life30 minutesShelf life1 Year THERMAL PROPERTIES:CTE, linear10.0 µin/in-°F @Temperature 68.0 °FThermal Conductivity6.94 BTU-in/hr-ft²-°FGlass transition temperature (Tg), °C110 °C, 230 °FOperating Temperature-70 to 125 °CCURED PROPERTIES:Hardness, Shore D90Dielectric strength, volts/mil410CURE SCHEDULE:2 – 4 Hours@ 65°C24 Hours@ 25°CELECTRICAL PROPERTIES:Volume Resistivity5.50e+15 ohm-cm | 4.00e+13 ohm-cm @Temperature 212 °FDielectric Constant6.0 @Frequency 1000 HzDielectric Strength410 kV/inDissipation Factor0.010 @Frequency 1000 Hz GENERAL INFORMATION:For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).HOW TO USE:1) Carefully clean and dry all surfaces to be bonded.2) Apply AA-BOND 2153 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best result.AVAILABILITY:This epoxy can be supplied in various different packages. Froo www.froo.com | Froo Cross Sell, Free Cross Sell, Cross promote, eBay Marketing, eBay listing Apps, eBay Apps, eBay Application
Price: 14.99 USD
Location: Warwick, Rhode Island
End Time: 2024-10-14T18:35:12.000Z
Shipping Cost: 0 USD
Product Images
Item Specifics
All returns accepted: ReturnsNotAccepted
Brand: Atom Adhesives
Model: 2153-2
MPN: AA-BOND 2153-2
Country/Region of Manufacture: United States
Benefits 1: Strong Duarable High impact bonds
Benefits 2: Passes NASA's Outgassing
Typical Applications 1: Staking transistors, diodes, resistors
Typical Applications 2: other heat-sensitive components to PCB
Typical Applications 3:: integrated circuits
