Solder Joint Technology: Materials, Properties, and Reliability by King-Ning Tu

Description: Solder Joint Technology by King-Ning Tu Estimated delivery 3-12 business days Format Hardcover Condition Brand New Description To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed. Publisher Description Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed. Author Biography King-Ning Tu is a Professor in the Department of Materials Science and Engineering at the University of California at Los Angeles. Since receiving his Ph.D. in Applied Physics from Harvard University in 1968, he has gained 25 years experience at IBM T. J. Watson Research Center as a Research Staff Member in the Physical Science Department. He is a Fellow of the American Physical Society, The Metallurgical Society (TMS), and an Overseas Fellow of Churchill College, Cambridge University. Professor Tu has published over 450 journal papers, authored a book (Solder Joint Technology, 2007) and co-a Details ISBN 0387388907 ISBN-13 9780387388908 Title Solder Joint Technology Author King-Ning Tu Format Hardcover Year 2007 Pages 370 Edition 2007th Publisher Springer-Verlag New York Inc. GE_Item_ID:137676164; About Us Grand Eagle Retail is the ideal place for all your shopping needs! With fast shipping, low prices, friendly service and over 1,000,000 in stock items - you're bound to find what you want, at a price you'll love! Shipping & Delivery Times Shipping is FREE to any address in USA. Please view eBay estimated delivery times at the top of the listing. Deliveries are made by either USPS or Courier. We are unable to deliver faster than stated. International deliveries will take 1-6 weeks. NOTE: We are unable to offer combined shipping for multiple items purchased. This is because our items are shipped from different locations. Returns If you wish to return an item, please consult our Returns Policy as below: Please contact Customer Services and request "Return Authorisation" before you send your item back to us. Unauthorised returns will not be accepted. Returns must be postmarked within 4 business days of authorisation and must be in resellable condition. Returns are shipped at the customer's risk. We cannot take responsibility for items which are lost or damaged in transit. For purchases where a shipping charge was paid, there will be no refund of the original shipping charge. Additional Questions If you have any questions please feel free to Contact Us. Categories Baby Books Electronics Fashion Games Health & Beauty Home, Garden & Pets Movies Music Sports & Outdoors Toys

Price: 272.38 USD

Location: Fairfield, Ohio

End Time: 2024-11-25T03:47:32.000Z

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